Federal Bid

Last Updated on 03 Jul 2009 at 8 AM
Solicitation
Location Unknown

Fracture Putty

Solicitation ID DARPA-BAA-08-50
Posted Date 04 Jun 2008 at 6 PM
Archive Date 03 Jul 2009 at 5 AM
NAICS Category
Product Service Code
Set Aside No Set-Aside Used
Contracting Office Def Advanced Research Projects Agcy
Agency Department Of Defense
Location United states
DARPA seeks to develop a dynamic putty which, when packed in/around a compound bone fracture, provides full load-bearing capabilities within hours, creates an osteoconductive bone-like internal structure, and degrades over time to harmless resorbable by-products as normal bone regenerates. "See attached Broad Agency Announcement(BAA)
Bid Protests Not Available

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