The Air Force Research Laboratory (AFRL), Space Vehicles Directorate (VS), Space Based Infrared Technology Branch (AFRL/VSSS) at Kirtland AFB NM is interested in receiving proposals from all offerors to advance the state-of-the-art and scientific knowledge in the area of high functionality, visible imaging sensor chip assemblies (SCAs). The total program budget for this effort is approximately $5M over three years. The Missile Defense Agency (MDA) will sponsor the work. The objective of this effort is to advance visible sensor state-of-the art for a future Space Tracking and Surveillance System (STSS) Block II insertion. The goal of this program is the development of high performance, high functionality visible sensor chip assemblies (SCA) for mid-course track sensors. Desired features of this SCA include large format, fast framing capability, windowing capability, and on-chip A/D conversion. The FPA will be based on a 512x512 (or larger) format meeting or exceeding the STSS current goals. Prospective offerors are encouraged to contact the technical POC to verify interest in the effort to be proposed as well as obtain the specific classified and unclassified goals of the objective system. The contractor will investigate methodologies, which include designing and/or processing of readout circuitry to improve radiation tolerance and determine the yield and cost of fabricating a lot of FPAs based on the goals provided. Up to fifty (50) FPAs are desired as deliverable to AFRL. The technical point of contact is Mr. Frank Roush, AFRL/VSSS, 505/853-3246, Email: [email protected]. Please download associated files available on FeBizOps for complete discription of this Business Opportunity, and proposal-submission requirements.

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